60 ml. COMBO KESTER 951 + KESTER 186 Soldering Liquid Flux Reflow NO CLEAN

Description

No Clean  (ROSIN-FREE ) Flux   - 30 ml. / 1  Oz.    KESTER 951
30
ml. / 1 Oz. KESTER 186 Rosin Flux  No Clean
TOTAL 2 BOTTLES COMBO
Alcohol based for a very clean job. leaves only a
white powder looking residue that don't require cleaning.
Dries as its heated coating the solder giving the
perfect flux to solder ratio for a healthy long lasting bond.
Kester 951 is a no-clean, non-conductive, non-corrosive, halogen and rosin-free liquid flux that is specifically designed for the wave soldering of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine, thus posing no interference with electrical testing. 951 has been developed for bare copper soldering applications. This comprehensive formulation possesses improved wetting characteristics, which continuing to exhibit superior corrosion inhibiting properties and providing a non-tacky residue that is considered non-corrosive and non-conductive by common industry specifications. This non-corrosive and non-conductive flux meets the strictest requirements of Bellcore TR-NWT-000078 and IPC-SF-818 specifications. A major advantage of this flux is the reduced odor associated with the soldering process.
Flux for Solar Cell Soldering
Gaming Systems and other soldering projects...
Kester 186, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.
NEEDED FOR XBOX 360 AND PLAYSTATION 3 REFLOW TO FIX THE RED RING OF DEATH AND THE YELLOW LIGHT OF DEATH
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