AMTECH Sn42/Bi57.6/Ag0.4 (T4) No-clean Lead-Free Low-Temp Solder Paste 35g

Description

AMTECH Sn42/Bi57.6/Ag0.4 (T4) No-clean Low-Temp Solder Paste (20-38μ, 87% Metal) - 35g syringe
Manufacturer guaranteed shelf life:
Refrigerated - 6 months / Room temperature - 1 month
Including Dispensing Kit (plunger and tip)
- Designed low-temperature applications
- ROL0 flux classification
- Exceptional print definition. Excellent wetting on all common finishes including Ni/Au
- REACH compliant
- Print & Dispense grade solder paste available.
Printer Operation
The following are general guidelines for stencil printer optimization with
Sn42/Bi57.6/Ag0.4 (T4)
.
Some adjustments may be necessary based on your process requirements
Print Speed
: 25-125 mm/sec
Squeegee Pressure:
70-250g/cm of blade
Under Stencil Wipe:
Once every 10-25 prints, or as necessary
Stensil Life
@ 30-45% RH & 20-25°C
@ 45-75% RH & 20-25°C
>12 hours
~ 4 hours
Viscosity - Printing
Malcom @ 10 RPM/25°C (x103mPa/s)
IPC-TM-650: 2.4.34.4
125-180
SAC305 T3/T4
Viscosity - Dispensing
Malcom @ 10 RPM/25°C (x103mPa/s)
IPC-TM-650: 2.4.34.4
90-130
SAC305 T3/T4
Tack Value
IPC-TM-650: 2.4.44
48g
Surface Insulation Resistance
85°C, 85% RH @ 168 Hours
IPC-TM-650: 2.6.3.7
L: ≥100 MΩ (no-clean)
Corrosion
IPC-TM-650: 2.6.15
L: No corrosion
Quantitative Halides
IPC-TM-650: 2.3.28.1
L: <0.05%
Copper Mirror
IPC-TM-650: 2.3.32
L: No breakthrough
Electrochemical Migration
IPC-TM-650: 2.6.14.1
L: <1 decade drop (no-clean)
Available Alloys
42Sn/58Bi
42Sn/57Bi/1Ag
43Sn/43Pb/14Bi
Cleaning
Sn42/Bi57.6/Ag0.4 (T4)
is a no-clean solder paste that does not require cleaning for most SMT assemblies. For applications requiring cleaning, it can be cleaned using commercial residue removers
.
Storage
Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum
refrigerated shelf life of six months
. Unopened solder paste stored at room temperature, 25°C (77°F) will have a one month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down. Allow 4-8 hours for solder paste to reach an optimal operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature.
NEVER FREEZE SOLDER PASTE!
Safety Notice
This product is designed for a professional audience. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers of AMTECH products should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.
AMTECH Low Oxide Powder Distribution
Micon Size
Type
Pitch Requirements
45 - 75μ
Type-2
24 mil and above
25 - 45μ
Type-3
16 - 24 mil
20 - 38μ
Type-4
12 - 16 mil
15 - 25μ
Type-5
8 - 12 mil
5 - 15μ
Type-6
5 - 8 mil
2 - 11μ
Type-7
< 5 mil
Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request.
Dispensing Kit
AMTECH factory syringes are intended for industrial dispensing machines and use piston stoppers, Dispensing Kit (plunger and tip) is not supplied by AMTECH and included as a third-party free value add-on, tip gauge (size) may be different (not as pictured), plunger is to push on a piston and otherwise can be loose
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